Specifications :
• Cu coated on Al2O3 wafer
• Cu thickness:100 nm ± 5%
• Cu orientation: <111> oriented
• Resistivity: 2.16 micro ohm-cm
• Roughness, RMS: 0.5 nm, < 1 nm
• Al2O3 substrate: 2 inch dia x 0.43 mm thickness, prime grade, c-plan
Contact e-mail : crystalbank@pusan.ac.kr for quotation and order
Measurement Data
EBSD image
AFM image
